Microvias: For Low Cost, High Density Interconnects
| By: | John H. Lau; Ricky S. W. Lee |
| Publisher: | McGraw-Hill Professional |
| Print ISBN: | 9780071363273 |
| eText ISBN: | 9780071382991 |
| Edition: | 1 |
| Format: | Page Fidelity |
eBook Features
Instant Access
Purchase and read your book immediately
Read Offline
Access your eTextbook anytime and anywhere
Study Tools
Built-in study tools like highlights and more
Read Aloud
Listen and follow along as Bookshelf reads to you
Details
Table of Contents